NSC DST2-TG | Double Target Turbo Pumped Sputter Coater and Thermal Evaporator for Glove Box Use

The DST2-TG, Double Target Turbo Pumped Sputter Coater and Thermal Evaporator for Glove Box Use, is a multi-vacuum coater system that combines thermal evaporator and sputter coater in one single compact desktop system with remote system control through a Wi-Fi connection, controllable by both touch screen and PC. The high vacuum system is suitable for the deposition of a wide range of materials. Double magnetron target desk sputter coater can easily switch between evaporation and sputtering deposition for the preparation of multilayer coatings.

Glove box systems provide a protected environment for sensitive material, preventing any contact with air or humidity and unwanted interactions. DST2-TG high-vacuum coating system with glove box offers a convenient chamber environment contributing to high purity thin layer deposition under high vacuum conditions, along with secure substrate handling under inert gas atmosphere.

The DST2-TG Magnetron Desk Sputter Coater is a high-precision semi/fully automated vacuum coating system equipped with a large chamber (300 mm diameter) and two 2” diameter water-cooled cathodes, which make it suitable for long-time deposition. The system is a single platform for sputtering, carbon fiber, and metal evaporation. The magnetron desk sputter coater can sputter semiconductors, dielectrics, and metal targets. Sputtering cathodes and thermal evaporation boats could be installed together or interchangeably, with an overall three deposition sources accessible (when placing the order). Carbon deposition is also made possible by utilizing carbon fiber.

The sputter coater and thermal evaporator for glove box can be equipped with optional facilities including:

  • RF power supply with an auto-adjustable matching box which minimizes the reflected power in the RF sputtering process
  • Plasma cleaner for removing organic matter from the substrate surface before thin film deposition 

Clean Vacuum

The vacuum chamber is Cylindrical Pyrex with 300 mm OD and 200-250 mm H. The DST2-TG is fitted with an internally mounted 90L/s turbo molecular pump, backed by a 6 m3/h two-stage rotary vain pump. The glovebox mounted DST2-TG introduces an extremely controllable chamber environment for high purity thin layer deposition, along with safe and clean sample handling before/after a deposition process under inert gas atmosphere inside the glove box.

Touch Screen Control

DST2-TG is equipped with a 7” colored touch-screen panel using user-friendly software to control and adjust the deposition process data. The panel window is also made available on pc through a Wi-Fi connection. The vacuum and coating sequence information can be observed as digital data or curves on the touch screen and the last 300 coatings are saved on the history page.

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        Features of DST2-TG

         Hardware 

  • Two-stage rotary vane backing pump
  • High-vacuum built-in turbo pump 90l/s
  • Full range vacuum gauge
  • Large chamber: (300 mm diameter, 20-25 cm height) suitable for large specimen depositions
  • Electrical lift arm to ride up and down the vacuum chamber
  • Two 2” water-cooled sputtering cathodes
  • Two quartz crystal sensors (1 nm precision) for real-time thickness measurement
  • Glovebox mounted KF40 feedthroughs for power supplies (DC, RF, high current (HC)), vacuum pump hose, water cooling and argon/reactive gas connections, and electrical connections.
  • Two precision Mass Flow meter (MFC) for fine control of vacuum and pressure
  • Electronic shutters
  • Cathode selection motor
  • Sample rotation, height and tilt adjustable

        Automation

  • Intuitive touch screen to control the coating process and rapid data input
  • User friendly software, updatable via network
  • Semi-Fully automatic coating process
  • Software controllable vertical movement of the vacuum glass chamber
  • Manual or automatic sputter coating in Timed and Thickness modes
  • Controlling the deposition process from pc through a Wi-Fi connection
  • Storing coating recipes for repeatable depositions
  • Automated cathode selection for multilayer thin film deposition

        Optional Facilities

  • RF sputtering for deposition of non-conducting targets (optional)
  • Plasma cleaner (optional)

        Specifications

  • Combination of sputter coater and thermal evaporator for glovebox mounting
  • Ultimate Vacuum: Less than 8×10-6Torr
  • Easy and quick target installation without need to target holder
  • Improved heat conduction utilizing targets with backing plate
  • Unlimited sputtering time without breaking vacuum
  • Independent sputtering control rate for each cathode to produce fine grain structures
  • Automatic safe control of the cathode’s temperatures to protect the life time of the magnets
  • Real-time plots of coating parameters graphs
  • Deposition process data transfer by a USB port or via Wi-Fi connection to PC
  • 0- 1200 V, 0-500 mA DC power supply
  • Utilities: 220V-110V, 50/60HZ, 4.5kW
  • Instrument dimensions: 550 (W) × 600 (D) × 600 (H) mm
  • Net weight:120kg (Pump, rack and instrument case)

        Options and Accessories

  • Quartz crystal sensor
  • Spare glass chamber
  • Sputtering targets
  • Sealing gaskets
  • Thermal source holders

        Applications

  • Metal, Semiconductor and Dielectric Films
  • Nano & Microelectronic
  • Solar cell applications
  • Thin film battery applications
  • Co-Sputtering processes
  • GLAD sputtering
  • Optical components coating
  • Thin film sensors
  • Magnetic thin film devices
  • Fine grain structural deposition for SEM & FE-SEM sample preparation
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