1. What is sputtering deposition?

Sputter deposition is a method of depositing thin films by sputtering material from a “target”. Sputtering is a term used to describe the mechanism in which atoms are ejected from the surface of a material when that surface is stuck by sufficiency energetic ions generated by low-pressure gas plasma, usually an argon plasma. The sputtering takes place at a much lower temperature than evaporation. Sputtered atoms ejected into the gas phase in vapor form are not in their thermodynamic equilibrium state and tend to condense on all surfaces in the vacuum chamber including the substrate.

2. Why are thin films important?

There are many useful applications for thin films. We desire to produce properties in a material that are often conflicting in nature if we use one homogeneous material. Semiconductor devices, for example, are fabricated on a thin layer deposited on a semiconductor substrate. The integrated electronic circuits depend on the confinement of electrical charges, which relies on the interfaces between different materials with different electronic properties. There are also many occasions when the properties demanded an engineering application involve features that are different for the surface than that are for the bulk. Depositing metal films and patterning them on the surface are relatively easy to secure electrical connection between semiconductor devices.

3.How does a sputtering system work?

Generally, in sputtering systems ions are generated and directed at a target, then ions sputter targets atoms. The ejected atoms are transported to the substrate and atoms condense and form a thin film. Below image shows the simple schematic of a sputtering system.

DST2-TG: Sputter Coater and Thermal Evaporator for Glove Box

The DST2-TG, Double Target Turbo Pumped Sputter Coater and Thermal Evaporator for Glove Box Use, is a multi-vacuum coater system that combines thermal evaporator and sputter coater in one single compact desktop system with remote system control through a Wi-Fi connection, controllable by both touch screen and PC. The high vacuum system is suitable for the deposition of a wide range of materials. Double magnetron target desk sputter coater can easily switch between evaporation and sputtering deposition for the preparation of multilayer coatings.

Request Invoice

Glove box systems provide a protected environment for sensitive material, preventing any contact with air or humidity and unwanted interactions. DST2-TG high-vacuum coating system with glove box offers safe and clean substrate handling before or after a deposition process under inert gas atmosphere, and a highly controllable chamber environment, contributing to high purity thin layer deposition under high vacuum conditions.

Applications

The DST2-TG, Magnetron Desk Sputter Coater, is equipped with a large chamber (300 mm diameter) and two 2” diameter water-cooled cathodes which make it suitable for long-time deposition. The DST2-TG is a single platform for sputtering, carbon fiber, and metal evaporation. The desk sputter coater for glove box can sputter semiconductors, dielectrics, and metal targets. Sputtering cathodes and thermal evaporation boats could be installed together or interchangeably, with an overall three deposition sources accessible. Carbon deposition is also made possible by utilizing carbon fiber.

NSC Product DST2-TG All Chamber Square without Frame Grey Big Border

This high-precision vacuum coating system is semi/fully automated, equipped with a 7” colored touch-screen panel using user-friendly software to control and adjust the deposition process data. The panel window is also made available on pc through a Wi-Fi connection. The vacuum and coating sequence information can be observed as digital data or curves on the touch screen and the last 300 coatings are saved on the history page.

NSC Product DST2-TG Touch Screen Square without Frame Grey Big Border

The sputter coater and thermal evaporator for glove box can be equipped with optional facilities including:

RF power supply with an auto-adjustable matching box which minimizes the reflected power in the RF sputtering process
Plasma cleaner for removing organic matter from the substrate surface before thin film deposition

NSC Product DST2-TG Inner Chamber Square Without Frame Grey Big Border

Features of DST2-TG

Hardware Specifications

Combination of sputter coater and thermal evaporator for glovebox mounting
Built-in turbomolecular pump
Large chamber: Dia. 30 cm, Height. 20-25 cm
Easy and quick target installation: No target holder needed
Boosted heat conduction utilizing targets with backing plate
Rotating sample holder
Glovebox mounted KF40 feedthroughs for power supplies (DC, RF, high current), vacuum pump hose, water cooling and argon/reactive gas connections, and electrical connections.
Gas injection control through MFCs
Two-precision quartz crystal thickness sensors