1. What is sputtering deposition?

Sputter deposition is a method of depositing thin films by sputtering material from a “target”. Sputtering is a term used to describe the mechanism in which atoms are ejected from the surface of a material when that surface is stuck by sufficiency energetic ions generated by low-pressure gas plasma, usually an argon plasma. The sputtering takes place at a much lower temperature than evaporation. Sputtered atoms ejected into the gas phase in vapor form are not in their thermodynamic equilibrium state and tend to condense on all surfaces in the vacuum chamber including the substrate.

2. Why are thin films important?

There are many useful applications for thin films. We desire to produce properties in a material that are often conflicting in nature if we use one homogeneous material. Semiconductor devices, for example, are fabricated on a thin layer deposited on a semiconductor substrate. The integrated electronic circuits depend on the confinement of electrical charges, which relies on the interfaces between different materials with different electronic properties. There are also many occasions when the properties demanded an engineering application involve features that are different for the surface than that are for the bulk. Depositing metal films and patterning them on the surface are relatively easy to secure electrical connection between semiconductor devices.

3.How does a sputtering system work?

Generally, in sputtering systems ions are generated and directed at a target, then ions sputter targets atoms. The ejected atoms are transported to the substrate and atoms condense and form a thin film. Below image shows the simple schematic of a sputtering system.

IUST Researchers: Deposition of Ti-Cu Layers with DST3-A

IUST Researchers Utilized NSC Triple-Cathode Sputter Coater, DST3-A, in Deposition of Antibacterial Ti-Cu Layers

The researchers at the Physics Department of Iran University of Science and Technology (IUST) achieved a Ti-Cu layer with antibacterial properties through the co-sputtering of Ti and Cu with DST3-A magnetron sputter coater manufactured by NanoStructured Coating Company (NSC). The significant results of this research are published in the Scientific Reports journal of Nature publications.

Schematic Images of the Preparation of Ti-Cu Thin Films Using the Co-Sputtering Method

DST3

The results of this research have shown the highest antibacterial ability against E. coli and S. aureus bacterial strains for the Ti₁₄-Cu₈₆ layer composition. The Ti layer was deposited on the glass and silicon substrates by applying RF voltage, while a DC power source was used to sputter the Cu target. Both targets were submitted to a 5-minute pre-sputtering process to remove the contaminants.

The samples were characterized by the SEM and AFM techniques to analyze their surface structures. The wettability of the structures is another verification parameter for the layer’s antibacterial property, the more hydrophobic layer shows better antibacterial behavior.

AFM Topographic 2D and 3D Maps of Ti49-Cu51

Sessile Drop Contact Angle Measurement of Deionized Water on the Prepared Thin Films on a Glass Surface

The SEM Image of the Cross-Section View of the Sample Ti49-Cu51

NanoStructured Coatings Company is a globally renowned designer and manufacturer of vacuum coating systems, offering versatile coating systems based on the physical vapor deposition (PVD) method for research and SEM sample preparation. Low and high-vacuum coating sputter coaters, carbon coaters, and hybrid sputter/carbon coaters are the most favorite NSC coating systems among users.

The angled triple-cathode desk sputter coater, DST3-A, is a powerful tool to perform state-of-the-art research projects where co-sputtering is required, whereas the straight triple-cathode sputter coater, DST3-S is ideal for consecutive uniform coating on larger (up to 8-inches) substrates.

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IUST Researchers: Deposition of Ti-Cu Layers with DST3-A

IUST Researchers Utilized NSC Triple-Cathode Sputter Coater, DST3-A, in Deposition of Antibacterial Ti-Cu Layers

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