1. What is sputtering deposition?

Sputter deposition is a method of depositing thin films by sputtering material from a “target”. Sputtering is a term used to describe the mechanism in which atoms are ejected from the surface of a material when that surface is stuck by sufficiency energetic ions generated by low-pressure gas plasma, usually an argon plasma. The sputtering takes place at a much lower temperature than evaporation. Sputtered atoms ejected into the gas phase in vapor form are not in their thermodynamic equilibrium state and tend to condense on all surfaces in the vacuum chamber including the substrate.

2. Why are thin films important?

There are many useful applications for thin films. We desire to produce properties in a material that are often conflicting in nature if we use one homogeneous material. Semiconductor devices, for example, are fabricated on a thin layer deposited on a semiconductor substrate. The integrated electronic circuits depend on the confinement of electrical charges, which relies on the interfaces between different materials with different electronic properties. There are also many occasions when the properties demanded an engineering application involve features that are different for the surface than that are for the bulk. Depositing metal films and patterning them on the surface are relatively easy to secure electrical connection between semiconductor devices.

3.How does a sputtering system work?

Generally, in sputtering systems ions are generated and directed at a target, then ions sputter targets atoms. The ejected atoms are transported to the substrate and atoms condense and form a thin film. Below image shows the simple schematic of a sputtering system.

Desk Sputter Coater/Thermal Evaporator - DST3-T

The DST3-T is a triple-target, turbo molecular-pumped, multi vacuum coater system, combines thermal evaporator and sputter coater in one single compact desktop system. It is suitable for deposition of a wide range of materials. The system can easily switch between evaporation and sputtering condition (Not simultaneously). The DST3-T is equipped with a large chamber (300 mm diameter) and three 2” diameter water cooled cathodes which make it suitable for long time deposition. The magnetron desk sputter coater is equipped with RF and DC power supplies. It can sputter semiconductors, dielectrics and metal (oxidizing & noble) targets. The system is equipped with an auto adjustable matching box, minimizing the reflected power in the RF sputtering process.

For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate (optional).

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According to state of the cathodes, DST3-T is available in two models:

DST3 – TA (Angled Cathodes):

The DST3-TA is equipped with three angled cathodes with a common focal point. It can sputter from two or three (optional) targets simultaneously or independently to form alloys or multilayer deposition respectively. The maximum size of substrates in this model could be 3 inches.

DST3 –TS (Straight Cathodes):

DST3-TS with three straight 2 inches water cooled cathodes is suitable for sputtering a single large specimen with diameter up to 20 Cm or several small specimens.

Thermal Evaporation

The DST3-T is equipped with a high current power supply and low-voltage (resistive) thermal evaporation platform suitable for a wide variety of thermal evaporation applications. The system allows controlled thermal evaporation of wide range materials onto substrate. Different types of thermal evaporation sources (Boat, Basket, and coil) can be installed on the single thermal source holder.

Features

Sputtering and Thermal evaporation process in a compact system
High vacuum level
Equipped with DC and RF power supplies suitable for metals, semiconductors and dielectrics
Three 2” water-cooled angled, magnetron cathodes suitable for producing alloy films (DST3-TA) and multilayer deposition
One thermal source installation
Two fixed and movable quartz crystal monitoring system for real time thickness measurement (1 nm precision)
Two MFCs
Manual or automatic Timed or Thickness deposition
Intuitive touch screen to control coating process and rapid data input
User friendly software that can be updated via network
Equipped with 3 manual shutters
Tilt able and change height of rotary sample holder with ability to selection of the cathodes
500 °C substrate heater (optional)
300 V DC substrate bias voltages (optional)
Unlimited deposition time without breaking vacuum
Two-year warranty

Applications

Metal, Semiconductor and Dielectric Films
Nano & Microelectronic
Solar cell applications
Co-Sputtering processes
Glad sputtering
Optical components coating
Thin film sensors
Magnetic thin film devices
Computer memory applications
Fine grain structural deposition for SEM & FE-SEM sample preparation

Clean Vacuum

The vacuum chamber is Cylindrical Pyrex with 300 mm OD and 200 mm H. The DST3-T is fitted with an internally mounted 90 l/s turbo molecular pump, backed by a 4 m³/h two stage rotary vain pump.

Touch Screen Control

DST3-T, is equipped with a 7” colored touch screen and semi-automatic control and data input that can be operated by even inexperienced users. The vacuum and deposition information can be observed as digital data or curves on the touch screen. Information of the last 300 coating can also be saved in the history page.

Sample Holder

The holder is made according to the conventional size of microscope slides, but the user can order customize size according to his/her needs. On the sample holder number of clamps is created to hold the small samples with a simple method during the rotation.

Plasma Cleaner

DST3-T is equipped to plasma cleaner option. Plasma cleaning is the process of removing organic matter from the surface of substrate through the use of an ionized gas called plasma. Pre-Cleaning the substrate prior to the deposition of film to eliminate contamination (C-based, Oxides) from substrate surface improve the adhesion between the substrate and the subsequent layers.

Specification

High vacuum turbo pump

Pumping Speed:	90 l/s	350 l/s
Ultimate Pressure:	7 x10^-6 Torr	7 x10^-7 Torr

Two stage rotary backing pump
Independent sputtering control rate for each cathode to produce fine grain structures
Automatic control of deposition power independent of pressure
Automatic control of the cathode’s temperatures to protect the life time of the magnets
Precision Mass Flow meters (MFC) for fine control of vacuum and so reactive sputtering
Records and plots of coating parameters graphs
Transfers curves and deposition process data by a USB port to PC
300V DC bias voltage (optional)
Equipped to plasma cleaner (optional)
Equipped to 500˚C substrate heater (optional)
0-1000 mA DC power supply
0-24 V, 0-100 A high current power supply
Water cooled high current electric feed through
300 W RF power supply with automatic matching box
Utilities: 220V-240V, 50/60HZ- 16A
Box Dimensions: 50 cm H x 60 cm W x 47 cm D
Shipping Weight:160 kg (pump, rack and box)